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Home > products > Electronic IC Chips > MTP16N25E Power Mosfet Transistor TMOS E–FET Power Field Effect Transistor

MTP16N25E Power Mosfet Transistor TMOS E–FET Power Field Effect Transistor

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Category:
Electronic IC Chips
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Specifications
Drain–Source Voltage:
250 Vdc
Drain–Gate Voltage:
250 Vdc
Operating And Storage Temperature:
–55 To 150 °C
Input Capacitance:
1558 PF
Output Capacitance:
281 PF
Reverse Transfer Capacitance:
130 PF
Highlight:

multi emitter transistor

,

silicon power transistors

Introduction

 

TMOS E–FET™ Power Field Effect Transistor

N–Channel Enhancement–Mode Silicon Gate

 

TMOS POWER FET

16 AMPERES 250 VOLTS

RDS(on) = 0.25 OHM

 

This advanced TMOS E–FET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.

 

• Avalanche Energy Specified

• Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode

• Diode is Characterized for Use in Bridge Circuits

• IDSS and VDS(on) Specified at Elevated Temperature

 

       

 

MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

Rating Symbol Value Unit
Drain–Source Voltage VDSS 250 Vdc
Drain–Gate Voltage (RGS = 1.0 MΩ) VDGR 250 Vdc

Gate–Source Voltage — Continuous

                                                          — Non–Repetitive (tp ≤ 10 ms)

VGS

VGSM

± 20

± 40

Vdc

Vpk

Drain Current — Continuous

                                      — Continuous @ 100°C

                                          — Single Pulse (tp ≤ 10 µs)

ID

ID

IDM

16

10

56

Adc

 

Apk

Total Power Dissipation @ TC = 25°C

Derate above 25°C

PD

125

1.0

Watts

W/°C

Operating and Storage Temperature Range TJ, Tstg –55 to 150 °C

Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C

(VDD = 80 Vdc, VGS = 10 Vdc, IL = 16 Apk, L = 3.0 mH, RG = 25 Ω)

EAS 384 mJ

Thermal Resistance — Junction to Case

                                    — Junction to Ambient

RθJC

RθJA

1.0

62.5

°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds TL 260 °C

 

 

 

 

Stock Offer (Hot Sell)

Part no. Quantity Brand D/C Package
NE34018-T1-A 64 250 NEC NEW SOT-343
REG710NA-2.5/250 250 TI/BB NEW SOT23-6
LC78630ED 248 SANYO NEW QFP
MSM8994-1VV 248 QUALCOMM NEW BGA
CS92210-CM 240 CIRRUS NEW QFP
CY7C1347G133AXC 240 CYPRESS NEW QFP
TMS320DA150PGE16AD 240 TI NEW TQFP
MRF9080LR5 239 FREESCALE NEW NI-360
LMH6702MAX 237 NS NEW SOP
RT8056GQW 236 RICHTEK NEW WDFN-10L
DG221DY 235 VISHAY NEW SOP16
GBU6J 232 FAIRCHILD NEW SIP4
ADM6996FCX-AD-R-1 229   NEW QFP
MRF9080R3 229 FREESCALE NEW NI-360
TDA7263L 227 ST NEW ZIP-10
FDC37C932QFP 225 SMC NEW QFP
REG104GA-2.7 225 TI/BB NEW SOT223
LC4256V75T100-10I 223 LATTICE NEW QFP
BA5801FS 220 ROHM NEW SOP
MT1389EE 212 MTK NEW QFP
THC63LVDM83R 206 THINE NEW SSOP
MT45W4MW16BFB-708WT 205 MICRON NEW BGA
MAX6459UTA+T 200 MAXIM NEW SOT23-6
S71PL064JAOBAW070 200 SPANSIO NEW BGA
LSI2128VE 199 LATTICE NEW QFP
NTMS5P02R2 197 0N NEW SOP
ES5107AE 192 CYRUSTEK NEW DIP40
MD2810-D08 192 MD NEW SSOP
HPCS1335 B0 191 CORTINA NEW BGA
AN22113A 190 PANASONIC NEW QFP

 

 

 

 

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