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Home > products > Electronic IC Chips > FDS6975 Power Mosfet Module Dual P - Channel , PowerTrenchTM MOSFET

FDS6975 Power Mosfet Module Dual P - Channel , PowerTrenchTM MOSFET

manufacturer:
Manufacturer
Description:
Mosfet Array 30V 6A 900mW Surface Mount 8-SOIC
Category:
Electronic IC Chips
Price:
Negotiate
Payment Method:
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Specifications
Drain-Source Voltage:
-30 V
Gate-Source Voltage:
±20 V
Drain Current - Continuous:
-6 A
Power Dissipation For Dual Operation:
2 W
Operating And Storage Temperature:
-55 To 150 °C
Thermal Resistance, Junction-to-Ambient:
78 °C/W
Highlight:

multi emitter transistor

,

silicon power transistors

Introduction

 

FDS6975 Dual P-Channel, Logic Level, PowerTrenchTM MOSFET

 

 

General Description

These P-Channel Logic Level MOSFETs are produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance.

 

These devices are well suited for notebook computer applications: load switching and power management, battery charging circuits, and DC/DC conversion.

 

Features

• -6 A, -30 V. RDS(ON) = 0.032 W @ VGS = -10 V,

                     RDS(ON) = 0.045 W @ VGS = -4.5 V.

• Low gate charge (14.5nC typical).

• High performance trench technology for extremely low RDS(ON).

• High power and current handling capability.

 

 

 

Absolute Maximum Ratings TA = 25℃ unless otherwise noted

Symbol Parameter Ratings Units
VDSS Drain-Source Voltage -30 V
VGSS Gate-Source Voltage ±20 V
ID

Drain Current - Continuous   (Note 1a)

- Pulsed

-6 A
-20
PD Power Dissipation for Dual Operation 2 W

Power Dissipation for Single Operation (Note 1a)

                                                              (Note 1b)

                                                              (Note 1c)

1.6
1
0.9
TJ ,TSTG Operating and Storage Temperature Range -55 to 150 °C

 

THERMAL CHARACTERISTICS

RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 78 °C/W
RθJC Thermal Resistance, Junction-to-Case (Note 1) 40 °C/W

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.

 

 

2. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2.0%.

 

 

 

 

Stock Offer (Hot Sell)

Part No. Quantity Brand D/C Package
IRF3707PBF 6217 IR 11+ TO-220
IRF5210PBF 2546 IR 15+ TO-220
IRF5800TRPBF 54000 IR 16+ TSOP-6
IRF6218PBF 8426 IR 06+ TO-220AB
IRF640NPBF 5610 IR 15+ TO-220
IRF640NSTRLPBF 4905 IR 16+ TO-263
IRF6638TRPBF 4492 IR 13+ SMD
IRF7303TRPBF 15463 IR 14+ SOP-8
IRF7328TRPBF 6288 IR 13+ SOP-8
IRF740B 49000 FSC 16+ TO-220
IRF740PBF 11487 IR 16+ TO-220
IRF7416TRPBF 23190 IR 16+ SOP-8
IRF7494TRPBF 9525 IR 14+ SOP-8
IRF7907TRPBF 12836 IR 13+ SOP-8
IRF8010PBF 17656 IR 16+ TO-220
IRF840PBF 14327 VISHAY 16+ TO-220
IRF8788TRPBF 21214 IR 12+ SOP-8
IRF9530NPBF 5539 IR 16+ TO-220
IRF9620PBF 3435 VISHAY 13+ TO-220
IRF9Z24N 9496 IR 16+ TO-220
IRFB3004PBF 8497 IR 09+ TO-220
IRFB31N20D 6973 IR 14+ TO-220
IRFB3207ZPBF 16234 IR 15+ TO-220
IRFB3306PBF 7959 IR 13+ TO-220
IRFB4227PBF 14319 IR 16+ TO-220
IRFB4310PBF 7645 IR 16+ TO-220
IRFB4332PBF 5199 IR 16+ TO-220
IRFB4332PBF 4735 IR 16+ TO-220
IRFB52N15DPBF 7716 IR 15+ TO-220
IRFI4019HG-117P 4847 IR 14+ TO-220-5

 

 

 

 

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