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Home > products > Electronic IC Chips > N Channel Powertrench Mosfet FDS6676AS Intregrated Circuit Computer Chip Board

N Channel Powertrench Mosfet FDS6676AS Intregrated Circuit Computer Chip Board

manufacturer:
Manufacturer
Description:
N-Channel 30 V 14.5A (Ta) 2.5W (Ta) Surface Mount 8-SOIC
Category:
Electronic IC Chips
Price:
negotiation
Payment Method:
T/T in advance or others
Specifications
Drain-Source Voltage:
30V
Main Line:
Ic,module,transistor,diodes,capacitor,resistor Etc
Gate-Source Voltage:
±20V
Temperature:
-50-+150°C
Factory Pack:
2500pcs/Reel
Package:
SOP-8
Highlight:

electronic chip board

,

electronic components ic

Introduction

N Channel Powertrench Mosfet FDS6676AS Intregrated Circuit Computer Chip Board

 

 

30V N-Channel PowerTrench FDS6676AS Electronic Components Original Stock

 

General Description

The FDS6676AS is designed to replace a single SO-8 MOSFET and Schottky diode in synchronous

DC:DC power supplies. This 30V MOSFET is designed to maximize power conversion efficiency, providing a low RDS(ON) and low gate charge. The FDS6676AS includes an integrated Schottky diode using Fairchild’s monolithic SyncFET technology.

 

Applications

• DC/DC converter

• Low side notebook

 

Features

• 14.5 A, 30 V. RDS(ON) max= 6.0 mΩ @ VGS = 10 V RDS(ON) max= 7.25 mΩ @ VGS = 4.5 V

• Includes SyncFET Schottky body diode

• Low gate charge (45nC typical)

• High performance trench technology for extremely low RDS(ON) and fast switching

• High power and current handling capability

 

Absolute Maximum Ratings TA=25o C unless otherwise noted

Symbol Parameter Rating Unit
VDSS  Drain-Source Voltage 30 V
VGSS Gate-Source Voltage ±20 V
ID

Drain Current – Continuous (Note 1a)

                      – Pulsed  

14.5 A
50
PD

Power Dissipation for Single Operation (Note 1a)

                                                   (Note 1b)

                                                   (Note 1c)

2.5 W
1.5
1
TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C

 

Thermal Characteristics

RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 50 W/°C
RθJC Thermal Resistance, Junction-to-Case (Note 1) 25

 

Package Marking and Ordering Information

Device Marking Device Reel Size Tape width Quantity
FDS6676AS FDS6676AS 13“ 12MM 2500 units
FDS6676AS FDS6676AS_NL 13” 12MM 2500 units

 

 

 

 

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MOQ:
5pcs