0878321420 Mosfet Power Module Electronics ICs Chip Integarted Circuts
low voltage power mosfet
,hybrid inverter circuit
A part of stock list
| CAP 0603 150PF 50V CL10C151JB8NNNC | 800000 | SAMSUNG | AC7502D |
| CAP 0603 180PF 50V CL10B181KB8NNNC | 800000 | SAMSUNG | AA20SEE |
| RES 0805 5K9 1% RC0805FR-075K9L | 500000 | YAGEO | 1606 |
| RES 0805 20K5 1% RC0805FR-0720K5 | 500000 | YAGEO | 1606 |
| C.I LNK623PG | 10000 | POWER | 1407 |
| C.I STM32F030K6T6 | 10000 | ST | 1549 |
| DIODO ES1J-E3/61T | 180000 | VISHAY | 1642/EJ |
| CAP 0603 10PF 50V NPO 5% CL10C100JB8NNNC | 400000 | SAMSUNG | CCBET1P |
| DIODO 1N5822 AMMO | 1000000 | MIC | 307260623445 |
| TRANS BF422 | 2000 | TOS | 5F |
| DIODO 1.5KE7.5CA-E3/4 | 5000 | VISHAY | 16+ |
| CONECTOR S3B-PH-SM4-TB(LF)(SN) | 3200 | JST | 15+ |
| CONEC. BM06B-SRSS-TB(LF)(SN) |
3000 | JST | 15+ |
| CONECTOR S4B-PH-SM4-TB(LF)(SN) | 9200 | JST | 2015.11 |
| C.I A2982SLWTR-T | 3100 | ALLEGRO | 1642 |
| OPTOACOPLADOR CNY74-4H | 1000 | VISHAY | V413H68 |
| DIODO S1G-E3/61T | 18000 | VISHAY | 1632/SG |
| CI ADS7866IDBVR | 2500 | TI | A66Y |
| CI MSP430F417IPMR | 2500 | TI | 69A2P1W |
| C.I MC14584BDR2G | 3000 | ON | PAC928 |
| C.I PIC12F508-I/SN | 1000 | MICROCHIP | 1624KC6 |
| C.I LM1117IMPX-3.3/NOPB | 2000 | TI | 4ARD/N05B |
Feature
Agency Certification CSA LR19980 UL E29179
General Product Family PCB Headers Series 87832
Application Wire-to-Board Comments Contact Molex for application in automotive industry
MolexKits Yes Overview milligrid Product Name Milli-Grid™
Physical Breakaway No Circuits (Loaded) 14 Circuits (maximum) 14 Color
- Resin Black First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant
No Guide to Mating Part No Keying to Mating Part Yes Lock to Mating Part Yes
Material - Metal Phosphor Bronze Material - Plating Mating Gold Material
- Plating Termination Tin Material - Resin Nylon Number of Rows 2 Orientation Vertical PCB Locator Yes PCB Retention None Packaging Type Tube Pitch - Mating Interface (in) 0.079 In Pitch - Mating Interface (mm) 2.00 mm Pitch - Term. Interface (in) 0.079 In Pitch - Term. Interface (mm) 2.00 mm Plating min: Mating (µin) 15 Plating min: Mating (µm) 0.38 Plating min: Termination (µin) 75 Plating min: Termination (µm) 1.88
Temperature Range - Operating -55°C to +105°C
Termination Interface: Style Surface Mount Electrical Current
- Maximum per Contact 2A Voltage - Maximum 125V
Solder Process Data Duration at Max.
Process Temperature (seconds) 10 Lead-free
Process Capability Reflow Capable (SMT only) Max. Cycles at Max.
Process Temperature 1 Process Temperature max. C 260
Material Info Reference - Drawing Numbers Product Specification
PS-87831-027 Sales Drawing SD-87832-006
Original Connect RJ45 Ethernet Jack Plug J00-0065NL for PBC Board
6EP3331-6SB00-0AY0 24V 1.3A Stabilized Power Supply Din Rail Mount
IXGH40N60C2D1 HiPer FASTTM TO-247 40A 600V DIP Mosfet IGBT 300W
CMX909BD5 Flexible Integrated Circuit Chip Low Power GMSK Packet Data Modem
UPS161 Synchronizing signal controlling CMOS LSI tv circuit boards led driver circuit board
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Original Connect RJ45 Ethernet Jack Plug J00-0065NL for PBC Board |
1 Port RJ45Through Hole 10/100 Base-TX, AutoMDIX
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6EP3331-6SB00-0AY0 24V 1.3A Stabilized Power Supply Din Rail Mount |
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IXGH40N60C2D1 HiPer FASTTM TO-247 40A 600V DIP Mosfet IGBT 300W |
IGBT PT 600 V 75 A 300 W Through Hole TO-247AD
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CMX909BD5 Flexible Integrated Circuit Chip Low Power GMSK Packet Data Modem |
38.4k Modem 24-SSOP
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UPS161 Synchronizing signal controlling CMOS LSI tv circuit boards led driver circuit board |
GT SERIES 3000VA 120V RACKMOUNT
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