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Home > products > Flash Memory IC Chip > New & Original Platform Flash In-System Programmable Configuration PROMs XCF32PVOG48C

New & Original Platform Flash In-System Programmable Configuration PROMs XCF32PVOG48C

manufacturer:
Manufacturer
Description:
IC PROM SRL/PAR 1.8V 32M 48TSOP
Category:
Flash Memory IC Chip
Price:
Negotiate
Payment Method:
T/T, Western Union, Paypal
Specifications
Input Leakage Current:
-10 To 10 µA
Input And Output High-Z Leakage Current:
-10 To 10 µA
CIN Input Capacitance:
8 PF (max)
Output Capacitance:
14 PF (max)
Internal Voltage Supply Current, Active Mode:
10 MA (max)
JTAG Supply Current, Active Mode:
5 MA (max)
Highlight:

programming ic chips

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ic programmer circuit

Introduction

 
Platform Flash In-System Programmable Configuration PROMs
 
Features
• In-System Programmable PROMs for Configuration of Xilinx® FPGAs
• Low-Power Advanced CMOS NOR Flash Process
• Endurance of 20,000 Program/Erase Cycles
• Operation over Full Industrial Temperature Range (–40°C to +85°C)
• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing
• JTAG Command Initiation of Standard FPGA Configuration
• Cascadable for Storing Longer or Multiple Bitstreams
• Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ)
• I/O Pins Compatible with Voltage Levels Ranging From 1.8V to 3.3V
• Design Support Using the Xilinx ISE® Alliance and Foundation™ Software Packages
• XCF01S/XCF02S/XCF04S
  ♦ 3.3V Supply Voltage
  ♦ Serial FPGA Configuration Interface
  ♦ Available in Small-Footprint VO20 and VOG20 Packages
• XCF08P/XCF16P/XCF32P
  ♦ 1.8V Supply Voltage
  ♦ Serial or Parallel FPGA Configuration Interface
  ♦ Available in Small-Footprint VO48, VOG48, FS48, and FSG48 Packages
  ♦ Design Revision Technology Enables Storing and Accessing Multiple Design Revisions for Configuration
  ♦ Built-In Data Decompressor Compatible with Xilinx Advanced Compression Technology
 
Absolute Maximum Ratings

 Symbol                     Description

XCF01S, XCF02S,
         XCF04S

XCF08P, XCF16P,        XCF32P Units
 VCCINT  Internal supply voltage relative to GND  –0.5 to +4.0  –0.5 to +2.7  V
 VCCO  I/O supply voltage relative to GND  –0.5 to +4.0  –0.5 to +4.0  V
 VCCJ  JTAG I/O supply voltage relative to GND  –0.5 to +4.0  –0.5 to +4.0  V
 VIN

 Input voltage with respect to
 GND

 VCCO < 2.5V  –0.5 to +3.6  –0.5 to +3.6  V
 VCCO ≥ 2.5V  –0.5 to +5.5  –0.5 to +3.6  V 
 VTS

 Voltage applied to High-Z
 output

 VCCO < 2.5V  –0.5 to +3.6  –0.5 to +3.6  V
 VCCO ≥ 2.5V  –0.5 to +5.5  –0.5 to +3.6  V
 TSTG Storage temperature (ambient)   –65 to +150   –65 to +150  °C
 TJ Junction temperature   +125   +125  °C

Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins can undershoot to –2.0V or overshoot to +7.0V, provided this overshoot or undershoot lasts less then 10 ns and with the forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.
3. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com.
 
Supply Voltage Requirements for Power-On Reset and Power-Down

Symbol                        Description

XCF01S, XCF02S,
       XCF04S

XCF08P, XCF16P,
      XCF32P

 Units
  Min  Max  Min  Max
 TVCCVCCINT rise time from 0V to nominal voltage(2)  0.2  50  0.2  50  ms
 VCCPORPOR threshold for the VCCINT supply   1    -  0.5  -  V
 TOEROE/RESET release delay following POR(3)  0.5   3  0.5  30  ms
 VCCPDPower-down threshold for VCCINT supply   -   1    -  0.5  V
 TRSTTime required to trigger a device reset when the VCCINT supply drops below the maximum VCCPD threshold  10   -  10   -  ms

Notes:
1. VCCINT, VCCO, and VCCJ supplies can be applied in any order.
2. At power up, the device requires the VCCINT power supply to monotonically rise to the nominal operating voltage within the specified TVCC rise time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly.
3. If the VCCINT and VCCO supplies do not reach their respective recommended operating conditions before the OE/RESET pin is released, then the configuration data from the PROM is not available at the recommended threshold levels. The configuration sequence must be delayed until both VCCINT and VCCO have reached their recommended operating conditions.
 
 

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