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Home > products > Flash Memory IC Chip > TMS320F28335PGFA Microcontrollers MCU Chips 32BIT 512KB Flash 176LQFP For Demanding Control

TMS320F28335PGFA Microcontrollers MCU Chips 32BIT 512KB Flash 176LQFP For Demanding Control

manufacturer:
Manufacturer
Description:
C28x C2000™ C28x Delfino™ Microcontroller IC 32-Bit Single-Core 150MHz 512KB (256K x 16) FLASH 176-LQFP (24x24)
Category:
Flash Memory IC Chip
Price:
Negotiate
Payment Method:
T/T, Western Union, Paypal
Specifications
Series:
DSP
D/c:
New
Feature:
Digital Signal Processors
Lead Time:
0-3 Days
Package:
TQFP176
Application:
Demanding Control Applications
Highlight:

microcontroller chip

,

microcontroller ic

Introduction

TMS320F28335PGFA Microcontrollers IC MCU 32BIT 512KB FLASH 176LQFP for demanding control applications.

 

 
 
Product Details
 

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.

 

Specifications
 
  • High-performance static CMOS technology
    • Up to 150 MHz (6.67-ns cycle time)
    • 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x)
    • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • More than 2M × 16 address reach
  • On-chip memory
    • F28335, F28333, F28235:
      256K × 16 flash, 34K × 16 SARAM
    • F28334, F28234:
      128K × 16 flash, 34K × 16 SARAM
    • F28332, F28232:
      64K × 16 flash, 26K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K × 16)
    • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock
    • Protects flash/OTP/RAM blocks
    • Prevents firmware reverse-engineering
  • Enhanced control peripherals
    • Up to 18 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to 6 event capture inputs
    • Up to 2 Quadrature Encoder interfaces
    • Up to 8 32-bit timers
      (6 for eCAPs and 2 for eQEPs)
    • Up to 9 16-bit timers
      (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals
    • Up to 2 CAN modules
    • Up to 3 SCI (UART) modules
    • Up to 2 McBSP modules (configurable as SPI)
    • One SPI module
    • One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 80-ns conversion rate
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug using hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™ and SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options:
    • Lead-free, green packaging
    • 176-ball plastic Ball Grid Array (BGA) (ZJZ)
    • 179-ball MicroStar BGA™ (ZHH)
    • 176-pin Low-Profile Quad Flatpack (LQFP) (PGF)
    • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
  • Temperature options:
    • A: –40°C to 85°C (PGF, ZHH, ZJZ)
    • S: –40°C to 125°C (PTP, ZJZ)
    • Q: –40°C to 125°C (PTP, ZJZ)
      (AEC Q100 qualification for automotive applications)

All trademarks are the property of their respective owners.

 

CM GROUP regular Stock:

 

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