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Home > products > Flash Memory IC Chip > AM3352BZCZ30 AM3352BZCZD80 AM3354BZCZA100 AM3354BZCZD80 Microcontroller Integrated Circuit MPU Sitara ARM Cortex-A8 MPU

AM3352BZCZ30 AM3352BZCZD80 AM3354BZCZA100 AM3354BZCZD80 Microcontroller Integrated Circuit MPU Sitara ARM Cortex-A8 MPU

manufacturer:
Manufacturer
Description:
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 324-NFBGA (15x15)
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
L1 Cache Data Memory:
32 KB
L1 Cache Instruction Memory:
32 KB
Maximum Operating Temperature:
+ 125 C
Minimum Operating Temperature:
- 40 C
Operating Supply Voltage:
1.1 V
I/O Voltage:
1.8 V, 3.3 V
Highlight:

semiconductor integrated circuit

,

pic microcontroller circuit

Introduction

AM3352BZCZ30 AM3352BZCZD80 AM3354BZCZA100 AM3354BZCZD80 Microcontroller Integrated Circuit MPU Sitara ARM Cortex-A8 MPU

 

1 Features

  • Up to 1-GHz SitaraTM ARM® Cortex®-A8 32‐Bit RISC Processor

    • – NEONTM SIMD Coprocessor

    • – 32KB of L1 Instruction and 32KB of Data Cache

      With Single-Error Detection (Parity)

    • – 256KB of L2 Cache With Error Correcting Code

      (ECC)

    • – 176KB of On-Chip Boot ROM

    • – 64KB of Dedicated RAM

    • – Emulation and Debug - JTAG

    • – Interrupt Controller (up to 128 Interrupt

      Requests)

  • On-Chip Memory (Shared L3 RAM)

    • – 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM

    • – Accessible to All Masters

    • – Supports Retention for Fast Wakeup

  • External Memory Interfaces (EMIF)

    • – mDDR(LPDDR), DDR2, DDR3, DDR3L Controller:

      • – mDDR: 200-MHz Clock (400-MHz Data Rate)

      • – DDR2: 266-MHz Clock (532-MHz Data Rate)

      • – DDR3: 400-MHz Clock (800-MHz Data Rate)

      • – DDR3L: 400-MHz Clock (800-MHz Data

        Rate)

      • – 16-Bit Data Bus

      • – 1GB of Total Addressable Space

      • – Supports One x16 or Two x8 Memory Device

        Configurations

    • – General-Purpose Memory Controller (GPMC)

      • – Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM)

      • – Uses BCH Code to Support 4-, 8-, or 16-Bit ECC

      • – Uses Hamming Code to Support 1-Bit ECC

    • – Error Locator Module (ELM)

      • – Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm

      • – Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms

2 Applications

  • Gaming Peripherals

  • Home and Industrial Automation

  • Consumer Medical Appliances

  • Printers

  • Smart Toll Systems

    • Connected Vending Machines

  • Weighing Scales

  • Educational Consoles
    • Advanced Toys

 

1.3 Description

The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available free of charge from TI.

The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGXTM Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.

The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.

Device Information

PART NUMBER

PACKAGE

BODY SIZE

AM3359ZCZ

NFBGA (324)

15.0 mm × 15.0 mm

AM3358ZCZ

NFBGA (324)

15.0 mm × 15.0 mm

AM3357ZCZ

NFBGA (324)

15.0 mm × 15.0 mm

AM3356ZCZ, AM3356ZCE

NFBGA (324), NFBGA (298)

15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm

AM3354ZCZ, AM3354ZCE

NFBGA (324), NFBGA (298)

15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm

AM3352ZCZ, AM3352ZCE

NFBGA (324), NFBGA (298)

15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm

AM3351ZCE

NFBGA (298)

13.0 mm × 13.0 mm

 

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