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Home > products > Flash Memory IC Chip > LMZ31520RLGT Mosfet Power Transistor Non-Isolated DC/DC Converters 20A Pwr Mod w/ 3.0V-14.5V Input

LMZ31520RLGT Mosfet Power Transistor Non-Isolated DC/DC Converters 20A Pwr Mod w/ 3.0V-14.5V Input

manufacturer:
Manufacturer
Description:
Non-Isolated PoL Module DC DC Converter 1 Output 0.6 ~ 3.6V 20A 3V - 14.5V Input
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
Packaging:
Cut Tape
Operating Temperature Range:
- 40 C To + 85 C
Maximum Operating Temperature:
+ 85 C
Minimum Operating Temperature:
- 40 C
Product Type:
Non-Isolated DC-DC Converters
Subcategory Roduct:
DC-DC Converter
Highlight:

mosfet motor control circuit

,

n channel mos field effect transistor

Introduction

LMZ31520RLGT Mosfet Power Transistor Non-Isolated DC/DC Converters 20A Pwr Mod w/ 3.0V-14.5V Input

 

1 Features

  • Complete Integrated Power Solution; Smaller than a Discrete Design
  • 15mm×16mm×5.8mmPackageSize - Pin Compatible with LMZ31530

  • Ultra-Fast Load Step Response

  • Efficiencies Up To 96%

  • Wide-Output Voltage Adjust
    0.6 V to 3.6 V, with 1% Reference Accuracy

  • Optional Split Power Rails Allows Input Voltage Down to 3 V

  • Selectable Switching Frequency (300 kHz to 850 kHz)

  • Selectable Slow-Start

  • Adjustable Overcurrent Limit

  • Power Good Output

  • Output Voltage Sequencing

  • Over Temperature Protection

  • Pre-bias Output Start-up

  • Operating Temperature Range: –40°C to 85°C

  • Enhanced Thermal Performance: 8.6°C/W

  • Meets EN55022 Class A Emissions - Integrated Shielded Inductor

  • Create a Custom Design Using the LMZ31520 With the WEBENCH® Power Designer

     

2 Applications

  • Broadband and Communications Infrastructure

  • DSP and FPGA Point of Load Applications

  • High Density Power Systems

     

3 Description

The LMZ31520 power module is an easy-to-use integrated power solution that combines a 20-A DC- DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 15×16×5.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31520 offers the flexibility and the feature-set of a discrete point-of- load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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