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Home > Products > Flash Memory IC Chip > SN74LVC2G08YZPR Programmable Logic ICS Logic Gates Dual 2-Input Pos

SN74LVC2G08YZPR Programmable Logic ICS Logic Gates Dual 2-Input Pos

Manufacturer:
MFG
Description:
AND Gate IC 2 Channel 8-DSBGA (1.9x0.9)
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
Number Of Input Lines:
2 Input
Number Of Gates:
2 Gate
Logic Family:
74LVC
Number Of Output Lines:
1 Output
High Level Output Current:
- 32 MA
Low Level Output Current:
32 MA
Introduction

SN74LVC2G08YZPR Programmable Logic ICS Logic Gates Dual 2-Input Pos

 

1 Features

  • Available in the Texas Instruments NanoStarTM and NanoFreeTM Package
  • Supports 5-V VCC Operation

  • Inputs Accept Voltages to 5.5 V

  • Maxtpd of4.7nsat3.3V

  • Low Power Consumption, 10-μA Maximum ICC

  • ±24-mA Output Drive at 3.3 V

  • Typical VOLP (Output Ground Bounce) <0.8VatVCC =3.3V,TA =25°C

  • Typical VOHV (Output VOH Undershoot) >2VatVCC =3.3V,TA =25°C

  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection

  • Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

  • ESD Protection Exceeds JESD 22

    • – 2000-V Human Body Model (A114-A)

    • – 1000-V Charged-Device Model (C101)

       

2 Applications

  • IP Phones: Wired and Wireless

  • Optical Networking: EPON and Video Over Fiber

  • Point-to-Point Microwave Backhaul

  • Power: Telecom DC/DC Module: Analog

  • Power: Telecom DC/DC Module: Digital

  • Private Branch Exchange (PBX)

  • Telecom Shelter: Power Distribution Unit (PDU)

  • Vector Signal Analyzers and Generators

  • Wireless Communications Testers

  • Wireless Repeaters

  • xDSL Modem/DSLAM

 

3 Description

This dual 2-input positive-AND gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G08 device performs the Boolean function Y = A x B or Y = A + B in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

SN74LVC2G08DCT

SM8 (8)

2.95 mm × 2.80 mm

SN74LVC2G08DCU

VSSOP (8)

2.30 mm × 2.00 mm

SN74LVC2G08YZP

DSBGA (8)

1.91 mm × 0.91 mm

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