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Home > products > Flash Memory IC Chip > EP3C40F324C8N EP3C40F484C8 EP3C40F484C8N EP3C40F484I7N EP3C40F780C6N EP3C40Q240C8N Programmable Logic ICS Field Program

EP3C40F324C8N EP3C40F484C8 EP3C40F484C8N EP3C40F484I7N EP3C40F780C6N EP3C40Q240C8N Programmable Logic ICS Field Program

manufacturer:
Manufacturer
Description:
Cyclone® III Field Programmable Gate Array (FPGA) IC 195 1161216 39600 324-BGA
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
Unit Weight:
0.056438 Oz
Subcategory:
Programmable Logic ICs
Total Memory:
1161216 Bit
Product Type:
FPGA - Field Programmable Gate Array
Moisture Sensitive:
Yes
Maximum Operating Frequency:
315 MHz
Highlight:

logic integrated circuits

,

programmable logic array ic

Introduction

EP3C40F324C8N EP3C40F484C8 EP3C40F484C8N EP3C40F484I7N EP3C40F780C6N EP3C40Q240C8N Programmable Logic ICS Field Program

 

Lowest Power FPGAs

  • Lowest power consumption with TSMC low-power process technology and Altera® power-aware design flow
  • Low-power operation offers the following benefits:

    • Extended battery life for portable and handheld applications

    • Reduced or eliminated cooling system costs

    • Operation in thermally-challenged environments

  • Hot-socketing operation support

     

Design Security Feature

Cyclone III LS devices offer the following design security features:

  • Configuration security using advanced encryption standard (AES) with 256-bit volatile key

  • Routing architecture optimized for design separation flow with the Quartus® II software

■ Design separation flow achieves both physical and functional isolation between design partitions

  • Ability to disable external JTAG port

  • Error Detection (ED) Cycle Indicator to core

    • Provides a pass or fail indicator at every ED cycle

    • Provides visibility over intentional or unintentional change of configuration

      random access memory (CRAM) bits

  • Ability to perform zeroization to clear contents of the FPGA logic, CRAM, embedded memory, and AES key

  • Internal oscillator enables system monitor and health check capabilities

    Increased System Integration

    • High memory-to-logic and multiplier-to-logic ratio

    • High I/O count, low-and mid-range density devices for user I/O constrained

      applications

      • Adjustable I/O slew rates to improve signal integrity

      • Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS

      • Supports the multi-value on-chip termination (OCT) calibration feature to eliminate variations over process, voltage, and temperature (PVT)

    • Four phase-locked loops (PLLs) per device provide robust clock management and synthesis for device clock management, external system clock management, and I/O interfaces

      • Five outputs per PLL

      • Cascadable to save I/Os, ease PCB routing, and reduce jitter

      • Dynamically reconfigurable to change phase shift, frequency multiplication or division, or both, and input frequency in the system without reconfiguring the device

    • Remote system upgrade without the aid of an external controller

    • Dedicated cyclical redundancy code checker circuitry to detect single-event upset

      (SEU) issues

    • Nios® II embedded processor for Cyclone III device family, offering low cost and custom-fit embedded processing solutions

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