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Home > products > Flash Memory IC Chip > SN74LVC2G125DCTRHigh Speed Programmable Logic ICS Buffers Line Drivers Live Insertion

SN74LVC2G125DCTRHigh Speed Programmable Logic ICS Buffers Line Drivers Live Insertion

manufacturer:
Manufacturer
Description:
Buffer, Non-Inverting 2 Element 1 Bit per Element 3-State Output SM8
Category:
Flash Memory IC Chip
Price:
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Specifications
Supply Voltage - Min:
1.65 V
Supply Voltage - Max:
5.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Logic Type:
True
Logic Family:
LVC
Highlight:

programmable computer chip

,

programmable logic array ic

Introduction

SN74LVC2G125DCTR Programmable Logic ICS Buffers & Line Drivers Tri-State Dual Bus

 

1 Features

  • ESD Protection Exceeds JESD 22
  • – 2000-V Human-Body Model
  • – 1000-V Charged-Device Model
  • Available in the Texas Instruments NanoFreeTM Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Maxtpd of4.3nsat3.3V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8VatVCC =3.3V,TA =25°C
  • Typical VOHV (Output VOH Undershoot) >2VatVCC =3.3V,TA =25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
  • to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

 

2 Applications

  • Cable Modem Termination Systems

  • High-Speed Data Acquisition and Generation

  • Military: Radars and Sonars

  • Motor Controls: High-Voltage

  • Power Line Communication Modems

  • SSDs: Internal or External

  • Video Broadcasting and Infrastructure: Scalable Platforms

  • Video Broadcasting: IP-Based Multi-Format Transcoders

  • Video Communications Systems

 

3 Description

The SN74LVC2G125 device is a dual bus buffer gate, designed for 1.65-V to 5.5-V VCC operation. This device features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high.

NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information

PART NUMBER

PACKAGE

BODY SIZE

SN74LVC2G125DCTR

SM8 (8)

2.95 mm × 2.80 mm

SN74LVC2G125DCUR

VSSOP (8)

2.30 mm × 2.00 mm

SN74LVC2G125YZPR

DSBGA (8)

1.91 mm × 0.91 mm

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