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Home > products > Flash Memory IC Chip > SN74LVC1G175DCKR Width 1.25 Mm Programmable Logic ICS Flip Flops Single D Type Flip Flop

SN74LVC1G175DCKR Width 1.25 Mm Programmable Logic ICS Flip Flops Single D Type Flip Flop

manufacturer:
Manufacturer
Description:
Flip Flop 1 Element D-Type 1 Bit Positive Edge 6-TSSOP, SC-88, SOT-363
Category:
Flash Memory IC Chip
Price:
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Payment Method:
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Specifications
Supply Voltage - Min:
1.65 V
Supply Voltage - Max:
5.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Brand:
Texas Instruments
Width:
1.25 Mm
Highlight:

programmable computer chip

,

programmable logic array ic

Introduction

SN74LVC1G175DCKR Programmable Logic ICS Flip Flops Single D-Type Flip-Flop

 

1 Features

  • Available in the Texas Instruments NanoFreeTM Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Maxtpd of4.3nsat3.3V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
  • – 2000-V Human-Body Model (A114-A)
  • – 200-V Machine Model (A115-A)
  • – 1000-V Charged-Device Model (C101)

 

2 Applications

  • TV/Set Top Box/Audio

  • EPOS (Electronic Point-of-Sale)

  • Motor Drives

  • PC/Notebook

  • Servers

  • Factory Automation and Control

  • Tablets

  • Medical Healthcare and Fitness

  • Smart Grid

  • Telecom Infrastructure

  • Enterprise Switching

  • Projectors

  • Storage

 

3 Description

This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G175 device has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.

NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

SN74LVC1G175DBV

SOT-23 (6)

2.90 mm × 1.60 mm

SN74LVC1G175DCK

SC70 (6)

2.00 mm × 1.25 mm

SN74LVC1G175DRY

SON (6)

1.45 mm × 1.00 mm

SN74LVC1G175YZP

DSBGA (6)

1.41 mm × 0.91 mm

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