LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp
audio preamplifier ic
,stereo amplifier ic chip
LMV611MF/NOPB Audio Power Amplifier IC Op Amps Lo Vltg,Low Pwr,RRIO Gen Purp amp
1 Features
- Supply Values: 1.8 V (Typical)
-
Ensured 1.8-V, 2.7-V, and 5-V Specifications
-
Output Swing:
-
– 80 mV From Rail With 600-Ω Load
-
– 30 mV From Rail With 2-kΩ Load
-
-
VCM = 200 mV Beyond Rails
-
100-μA Supply Current (Per Channel)
-
1.4-MHz Gain Bandwidth Product
-
Maximum VOS = 4 mV
-
Temperature Range: −40°C to +125°C
-
Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer
2 Applications
-
Consumer Communication
-
Consumer Computing
-
PDAs
-
Audio Pre-Amplifiers
-
Portable or Battery-Powered Electronic Equipment
-
Supply Current Monitoring
-
Battery Monitoring
3 Description
The LMV61x devices are single, dual, and quad low- voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends 200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-μA (typical) quiescent current.
The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.
The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.
Device Information
|
PART NUMBER |
PACKAGE |
BODY SIZE (NOM) |
|
LMV611 |
SOT-23 (5) |
2.92 mm × 1.60 mm |
|
SC70 (5) |
2.00 mm × 1.25 mm |
|
|
LMV612 |
VSSOP (8) |
3.00 mm × 3.00 mm |
|
SOIC (8) |
4.90 mm × 3.91 mm |
|
|
LMV614 |
TSSOP (14) |
5.00 mm × 4.40 mm |
|
SOIC (14) |
8.64 mm × 3.90 mm |
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