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Home > products > Flash Memory IC Chip > CSD97395Q4M Power Path Management IC Gate Drivers CSD97395Q4M High Frq Syn Buck NexFET

CSD97395Q4M Power Path Management IC Gate Drivers CSD97395Q4M High Frq Syn Buck NexFET

manufacturer:
Manufacturer
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
Subcategory:
PMIC - Power Management ICs
Product Type:
Gate Drivers
Moisture Sensitive:
Yes
Brand:
Texas Instruments
Technology:
Si
Operating Temperature Range:
- 40 C To + 150 C
Highlight:

battery charge management ic

,

power management integrated circuit

Introduction

CSD97395Q4M Power Path Management IC Gate Drivers CSD97395Q4M High Frq Syn Buck NexFET

 

1 Features

  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A

  • High Frequency Operation (up to 2 MHz)

  • High Density – SON 3.5 mm × 4.5 mm Footprint

  • Ultra-Low Inductance Package

  • System-Optimized PCB Footprint

  • Ultra-Low Quiescent (ULQ) Current Mode

  • 3.3 V and 5 V PWM Signal Compatible

  • Diode Emulation Mode With FCCM

  • Input Voltages up to 24 V

  • Tri-State PWM Input

  • Integrated Bootsrap Diode

  • Shoot Through Protection

  • RoHS Compliant – Lead Free Terminal Plating

  • Halogen Free

 

2 Applications

• Ultrabook/Notebook DC/DC Converters

• Multiphase Vcore and DDR Solutions

• Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems

 

3 Description

The CSD97395Q4M NexFETTM Power Stage is a highly optimized design for use in a high-power, high- density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 μA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 μA (typically 20 μs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

Device Information

ORDER NUMBER

PACKAGE

MEDIA AND QTY

CSD97395Q4M

SON 3.5 × 4.5 mm Plastic Package

13-inch reel 2500

CSD97395Q4MT

7-inch reel 250

 
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