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Home > products > Flash Memory IC Chip > TPS53640RSBR Power Path Management IC Switching Controllers 3-Phase, D-CAP+TM Stp-Dwn Controller

TPS53640RSBR Power Path Management IC Switching Controllers 3-Phase, D-CAP+TM Stp-Dwn Controller

manufacturer:
Manufacturer
Category:
Flash Memory IC Chip
Price:

Specifications
Subcategory:
PMIC - Power Management ICs
Product Type:
Switching Controllers
Operating Supply Current:
10 MA
Moisture Sensitive:
Yes
Brand:
Texas Instruments
Operating Temperature Range:
- 10 C To + 105 C
Highlight:

power management integrated circuit

,

battery charge management ic

Introduction

TPS53640RSBR Power Path Management IC Switching Controllers 3-Phase, D-CAP+TM Stp-Dwn Controller

 

(1)The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

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