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Home > products > Integrated Circuit Chips > CSD97374Q4M Lithium Ion Battery Charger IC , Li Ion Charger Chip Sync Buck Gate Drivers

CSD97374Q4M Lithium Ion Battery Charger IC , Li Ion Charger Chip Sync Buck Gate Drivers

manufacturer:
Manufacturer
Description:
IC HALF BRIDGE DRIVER 25A 8VSON
Category:
Integrated Circuit Chips
Price:
Contact us
Payment Method:
Paypal, Western Union, TT
Specifications
Unit Weight:
0.001831 Oz
Product Type:
Gate Drivers
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 150 C
Condition:
Original 100%,New And Original
Stock Status:
In Stock
Highlight:

battery charge management ic

,

power management integrated circuit

Introduction

CSD97374Q4M Power Path Management IC Gate Drivers Hi Freq Sync Buck NexFET Pwr Stage

 

1 Features

  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A

  • High-Frequency Operation (up to 2 MHz)

  • High-Density SON 3.5-mm x 4.5-mm Footprint

  • Ultra-Low Inductance Package

  • System Optimized PCB Footprint

  • Ultra-Low Quiescent (ULQ) Current Mode

  • 3.3-V and 5-V PWM Signal Compatible

  • Diode Emulation Mode with FCCM

  • Input Voltages up to 24 V

  • Tri-State PWM Input

  • Integrated Bootstrap Diode

  • Shoot-Through Protection

  • RoHS Compliant – Lead-Free Terminal Plating

  • Halogen Free

     

2 Applications

  • Ultrabook/Notebook DC/DC Converters

  • Multiphase Vcore and DDR Solutions

  • Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems

     

3 Description

The CSD97374Q4M NexFETTM power stage is a highly optimized design for use in a high-power, high- density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for WindowsTM 8. With the PWM input in tri-state, quiescent current is reduced to 130 μA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 μA (typically 20 μs is required to resume switching). This combination produces a high-current, high-efficiency, and high- speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Device Information

DEVICE

QTY

MEDIA

PACKAGE

SHIP

CSD97374Q4M

2500

13-Inch Reel

SON 3.50-mm × 4.50-mm Plastic Package

Tape and Ree

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