NCP3170BDR2G Electronic IC Chips Synchronous PWM Switching Converter
electronic integrated circuit
,linear integrated circuits
NCP3170
Synchronous PWM Switching Converter
The NCP3170 is a flexible synchronous PWM Switching Buck Regulator. The NCP3170 operates from 4.5 V to 18 V, sourcing up to 3 A and is capable of producing output voltages as low as 0.8 V. The NCP3170 also incorporates current mode control. To reduce the number of external components, a number of features are internally set including soft start, power good detection, and switching frequency. The NCP3170 is currently available in an SOIC−8 package.
Features
• 4.5 V to 18 V Operating Input Voltage Range
• 90 m High-Side, 25 m Low-Side Switch
• FMEA Fault Tolerant During Pin Short Test
• 3 A Continuous Output Current
• Fixed 500 kHz and 1 MHz PWM Operation
• Cycle-by-Cycle Current Monitoring
• 1.5% Initial Output Accuracy
• Internal 4.6 ms Soft-Start
• Short-Circuit Protection
• Turn on Into Pre-bias
• Power Good Indication
• Light Load Efficiency
• Thermal Shutdown
• These are Pb-Free Devices
Typical Applications
• Set Top Boxes
• DVD/Blu−ray Drives and HDD
• LCD Monitors and TVs
• Cable Modems
• PCIe Graphics Cards
• Telecom/Networking/Datacom Equipment
• Point of Load DC/DC Converters
ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 3, unless otherwise noted)
| Rating | Symbol | VMin | VMax | Unit |
|---|---|---|---|---|
| Main Supply Voltage Input | VIN | −0.3 | 20 | V |
| Voltage between PGND and AGND | VPAG | −0.3 | 0.3 | V |
| PWM Feedback Voltage | FB | −0.3 | 6 | V |
| Error Amplifier Voltage | COMP | −0.3 | 6 | V |
| Enable Voltage | EN | −0.3 | VIN + 0.3 V | V |
| PG Voltage | PG | −0.3 | VIN + 0.3 V | V |
| VSW to AGND or PGND | VSW | −0.7 | VIN + 0.3 V | V |
| VSW to AGND or PGND for 35ns | VSWST | −5 | VIN + 10 V | V |
| Junction Temperature (Note 1) | TJ | +150 | °C | |
| Operating Ambient Temperature Range | TA | −40 to +85 | °C | |
| Storage Temperature Range | Tstg | − 55 to +150 | °C | |
|
Thermal Characteristics (Note 2) SOIC−8 Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance Junction-to-Air Thermal Resistance Junction-to-Case |
PD RθJA RθJC |
1.15 87 37.8 |
W °C/W °C/W |
|
|
Lead Temperature Soldering (10 sec): Reflow (SMD Styles Only) Pb-Free (Note 3) |
RF | 260 peak | °C | |
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. The maximum package power dissipation limit must not be exceeded.
PD= [TJ(max) - TA] / RθJA
2. The value of JA is measured with the device mounted on 2in x 2in FR−4 board with 2oz. copper, in a still air environment with TA = 25°C. The value in any given application depends on the user’s specific board design.
3. 60−180 seconds minimum above 237°C.
Stock Offer (Hot Sell)
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| MMBTA14 | 6000 | FSC | 05+ | SOT23-3 |
| MMBTA42LT1G | 9000 | LRC | 15+ | SOT-23 |
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| MMSZ6V2T1G | 9000 | ON | 13+ | SOD-123 |
| MOC3022S-TA1 | 22000 | LITEON | 15+ | SMD |
| MOC3023M | 14343 | FSC | 16+ | DIP-6 |
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| MOC3041M | 18232 | FSC | 16+ | DIP |
| MOC3052VM | 19226 | FAIRCHILD | 16+ | DIP-6 |
| MOC3063SR2M | 12126 | FSC | 15+ | SOP |
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