MBRS1100T3G Rectifier Diode Schottky Power Rectifier Surface Mount
diode rectifier circuit
,bridge rectifier circuit
MBRS1100T3, MBRS190T3
Schottky Power Rectifier
Surface Mount Power Package
1.0 AMPERE
90, 100 VOLTS
Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. These state-of-the-art devices have the following features:
Features
• Pb−Free Packages are Available
• Small Compact Surface Mountable Package with J-Bend Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• High Blocking Voltage − 100 Volts
• 175°C Operating Junction Temperature
• Guardring for Stress Protection
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 95 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
• Shipped in 12 mm Tape and Reel, 2500 units per reel
• Cathode Polarity Band
MAXIMUM RATINGS
| Rating | Symbol | Value | Unit | |
|---|---|---|---|---|
|
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage |
MBRS190T3 |
VRRM VRWM VR |
90 |
V |
| MBRS1100T3 | 100 | |||
|
Average Rectified Forward Current |
TL = 163°C | IF(AV) | 1.0 | A |
| TL = 148°C | 2.0 | |||
|
Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) |
IFSM | 50 | A | |
| Operating Junction Temperature (Note 1) | TJ | −65 to +175 | °C | |
| Voltage Rate of Change | dv/dt | 10 | V/ns | |
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RJA.
Stock Offer (Hot Sell)
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