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Home > products > Flash Memory IC Chip > UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components

UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components
Category:
Flash Memory IC Chip
Price:
Negotiation
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Specifications
High-density Surface Mounting:
6-pin Super Minimold Package
Supply Voltage:
VCC = 4.5 To 5.5 V
Wideband Response:
Fu = 2.3 GHz TYP. @3 DB Bandwidth
Medium Output Power:
PO (sat) = +11.5 DBm@f = 1 GHz With External Inductor
Power Gain:
GP = 23 DB TYP. @f = 1 GHz
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Introduction

UPC2709TB - E3 Integrated Circuit Chip , Output Power Amplifier IC Electronic Components


FEATURES

• High-density surface mounting : 6-pin super minimold package

• Supply voltage : VCC = 4.5 to 5.5 V

• Wideband response : fu = 2.3 GHz TYP. @3 dB bandwidth

• Medium output power : PO (sat) = +11.5 dBm@f = 1 GHz with external inductor

• Power gain : GP = 23 dB TYP. @f = 1 GHz

• Port impedance : input/output 50 Ω

 

APPLICATIONS

• 1st IF amplifiers in DBS converters

• RF stage buffer in DBS tuners, etc.

 

DESCRIPTION

The µPC2709TB is a silicon monolithic integrated circuits designed as 1st IF amplifier for DBS tuners. This IC is packaged in super minimold package which is smaller than conventional minimold.

 

The µPC2709TB has compatible pin connections and performance to µPC2709T of conventional minimold version. So, in the case of reducing your system size, µPC2709TB is suitable to replace from µPC2709T.

 

These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

 

 

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