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Home > products > Flash Memory IC Chip > LMV321IDCKR Digital Audio Power Amplifier IC Chips Op Amps No Crossover Distortion

LMV321IDCKR Digital Audio Power Amplifier IC Chips Op Amps No Crossover Distortion

manufacturer:
Manufacturer
Description:
General Purpose Amplifier 1 Circuit Rail-to-Rail SC-70-5
Category:
Flash Memory IC Chip
Price:
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Payment Method:
Paypal, Western Union, TT
Specifications
Supply Voltage - Min:
2.7 V
Supply Voltage - Max:
5.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Supply Type:
Single
Technology:
BiCMOS
Highlight:

stereo amplifier ic chip

,

audio preamplifier ic

Introduction

LMV321IDCKR Audio Power Amplifier IC Op Amps Low V R/R

 

1 Features

  • 2.7-V and 5-V Performance
  • –40°C to 125°C Operation
  • Low-Power Shutdown Mode (LMV324S)
  • No Crossover Distortion
  • Low Supply Current
  • – LMV321: 130 μA Typ
  • – LMV358: 210 μA Typ
  • – LMV324: 410 μA Typ
  • – LMV324S: 410 μA Typ
  • Rail-to-Rail Output Swing
  • ESD Protection Exceeds JESD 22
  • – 2000-V Human-Body Model
  • – 1000-V Charged-Device Model

 

2 Applications

  • Desktop PCs
  • HVAC: Heating, Ventilating, and Air Conditioning
  • Motor Control: AC Induction
  • Netbooks
  • Portable Media Players
  • Power: Telecom DC/DC Module: Digital
  • Pro Audio Mixers
  • Refrigerators
  • Washing Machines: High-End and Low-End

 

3 Description

The LMV321, LMV358, LMV324, and LMV324S devices are single, dual, and quad low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing. These devices are the most cost- effective solutions for applications where low-voltage operation, space saving, and low cost are needed. These amplifiers are designed specifically for low- voltage (2.7 V to 5 V) operation, with performance specifications meeting or exceeding the LM358 and LM324 devices that operate from 5 V to 30 V. With package sizes down to one-half the size of the DBV (SOT-23) package, these devices can be used for a variety of applications.

Device Information

PART NUMBER

PACKAGE (PIN)

BODY SIZE

LMV324

SOIC (14)

8.65 mm × 3.91 mm

LMV321

SOT-23 (5)

2.90 mm × 1.60 mm

SC-70 (5)

2.00 mm × 1.25 mm

LMV358

VSSOP (8)

2.30 mm × 2.00 mm

VSSOP (8)

3.00 mm × 3.00 mm

TSSOP (8)

3.00 mm × 4.40 mm

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