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Home > products > Flash Memory IC Chip > LM5109BMAX/NOPB Power Path Management IC Gate Drivers Hi Vtg 1A Peak Half Bridge Gate Dvr

LM5109BMAX/NOPB Power Path Management IC Gate Drivers Hi Vtg 1A Peak Half Bridge Gate Dvr

manufacturer:
Manufacturer
Description:
Half-Bridge Gate Driver IC Non-Inverting 8-SOIC
Category:
Flash Memory IC Chip
Price:
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Payment Method:
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Specifications
Packaging:
Cut Tape
Height:
1.45 Mm
LeCM GROUPh:
4.9 Mm
Operating Temperature Range:
- 40 C To + 125 C
Technology:
Si
Width:
3.9 Mm
Highlight:

power management integrated circuit

,

microchip battery management

Introduction

LM5109BMAX/NOPB Power Path Management IC Gate Drivers Hi Vtg 1A Peak Half Bridge Gate Dvr

 

1 Features

  • Drives Both a High-Side and Low-Side N-Channel MOSFET
  • 1-A Peak Output Current (1.0-A Sink and 1.0-A Source)

  • Inputs Compatible With Independent TTL and CMOS

  • Bootstrap Supply Voltage to 108-V DC

  • Fast Propagation Times (30 ns Typical)

  • Drives 1000-pF Load With 15-ns Rise and Fall Times

  • Excellent Propagation Delay Matching (2 ns Typical)

  • Supply Rail Undervoltage Lockout

  • Low Power Consumption

  • 8-Pin SOIC and Thermally-Enhanced 8-Pin WSON Package

     

2 Applications

  • Current-Fed, Push-Pull Converters

  • Half- and Full-Bridge Power Converters

  • Solid-State Motor Drives

  • Two-Switch Forward Power Converters

 

3 Description

The LM5109B device is a cost-effective, high-voltage gate driver designed to drive both the high-side and the low-side N-channel MOSFETs in a synchronous buck or a half-bridge configuration. The floating high-side driver is capable of working with rail voltages up to 90 V. The outputs are independently controlled with cost-effective TTL and CMOS-compatible input thresholds. The robust level shift technology operates at high speed while consuming low power and providing clean level transitions from the control input logic to the high-side gate driver. Undervoltage lockout is provided on both the low-side and the high-side power rails. The device is available in the 8-pin SOIC and thermally- enhanced 8-pin WSON packages.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LM5109B

SOIC (8)

4.90 mm × 3.91 mm

WSON (8)

4.00 mm × 4.00 mm

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