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8MHz 5V 256×1 TSL1402R​ Linear Sensor Array With Hold DIP14

Minimum Order Quantity : 5-10pcs Price : To be negotiated
Packaging Details : standard safe package polybag and carton Delivery Time : in stock 2-3days
Payment Terms : T/T, Western Union ,paypal Supply Ability : 10,000PCS
Place of Origin: USA Brand Name: TAOS
Certification: CE/ RoHS Model Number: TSL1402R

Detail Information

PN: TSL1402R​ BRANDS: TAOS
ORIGNAL: USA TYPE: 256 × 1 Linear Sensor Array With Hold DIP14
VOLTAGE: Single 3-V To 5-V Supply PACKAGE: DIP14
High Light:

8MHz Linear Sensor Array

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TSL1402R​ Linear Sensor Array

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DIP14 Gas Sensors Linear Array

Product Description

TSL1402R​ #  256 × 1 Linear Sensor Array With Hold DIP14

Linear Sensor  Array 256X1   

 

 

NC − No internal connection:
 256 × 1 Sensor-Element Organization
 400 Dots-Per-Inch (DPI) Sensor Pitch
 High Linearity and Uniformity
 Wide Dynamic Range . . . 4000:1 (72 dB)
 Output Referenced to Ground
 Low Image Lag ... 0.5% Typ
 Operation to 8 MHz
 Single 3-V to 5-V Supply
 Rail-to-Rail Output Swing (AO)
 No External Load Resistor Required
 Replacement for TSL1402
 
 
Description:
The TSL1402R linear sensor array consists of two sections of 128 photodiodes each and associated charge
amplifier circuitry, aligned to form a contiguous 256 × 1 pixel array. The device incorporates a pixel data-hold
function that provides simultaneous integration start and stop times for all pixels. The pixels measure 63.5 μm
by 55.5 μm, with 63.5-μm center-to-center spacing and 8-μm spacing between pixels. Operation is simplified
by internal logic requiring only a serial-input pulse (SI) and a clock.
The TSL1402R is intended for use in a wide variety of applications including mark and code reading, OCR and
contact imaging, edge detection and positioning, and optical encoding
 
 
MECHANICAL INFORMATION:
This assembly consists of 2 sensor chips mounted on a printed-circuit board in a clear molded plastic package.
 
 
Notes:
A. All linear dimensions are in millimeters.
B. The true-position spacing is 2.54 mm between lead centerlines. Each pin centerline is located within 0.25 mm of its true
     longitudinal positions.
C. Index of refraction of clear plastic is 1.52.
D. The gap between the individual sensor dies in the array is 57 μm typical (51 μm minimum and 75 μm maximum).
E. This drawing is subject to change without notice.
 
 
THEORETICAL PIXEL LAYOUT FOR IDEAL CONTINUOUS DIE
ACTUAL MULTI-DIE PIXEL LAYOUT FOR DIE-TO-DIE EDGE JOINING
 
 
Notes 2: 
A. All linear dimensions are in micrometers.
B. Spacing between outside pixels of adjacent die is typical.
C. Die-to-die spacing.
D. This drawing is subject to change without notice.
Figure 12. Edge Pixel Layout Dimensions
 
 
Production Data :
— information in this document is current at publication date.
Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty.
Production processing does not necessarily include testing of all parameters.
 
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